The hydrated silicon dioxide with three layers structure of micron-submicron-millimicron was observed through TEM.
通过电镜实
,
到水合二
硅具有微
亚微
纳
三次结构。
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学 Finally, the wafer is sent to a chemical-mechanical planarization tool, where the metal is ground down so that all that remains is a flat layer of insulating silicon dioxide and conductive copper interconnects that match the pattern from the photomask.
最后,
片被送到
学机械平面
设备中,金属层被磨平, 只剩下一层平坦
绝缘


和与光掩模图案相匹配
导电铜互连层。